Thintronics

AnInterconnectDielectricPlatformfortheTerabitEra

Latest from Yahoo Finance

Thintronics Secures Up to $50M from the U.S. Department of Commerce to Take on the Dielectric Bottleneck Holding Back AI.

Thintronics has signed a Letter of Intent with the U.S. Department of Commerce for up to $50 million in CHIPS Act incentives to accelerate our next-generation substrate dielectric technology. The material at the heart of every chip substrate has long been treated as solved — it isn't. As AI pushes toward terabit interconnects, incumbent dielectrics are hitting physical limits, and nearly all of it comes from a single foreign supplier. This funding helps us fix both: building a U.S.-based alternative engineered for what the semiconductor industry actually needs now.

Read article

Press

— LEARN —

Watch Our Brand Film

Advanced chips still rely on inner layer dielectrics from one Asian supplier, a choke point that once shut down auto production and now limits performance. Thintronics is reinventing interconnect dielectrics through integrated computational, molecular, electrical, and process engineering, delivering a 10X, made in the USA, alternative for the terabit age.

— VISION —

A Unified Dielectric that Works Everywhere

A single, insertion loss optimized, insulator form-factor that works across the interconnect stack: PCB, Substrate, and Interposer.

Enables the lowest pj/bit
Simplifies supply chain
SAP, MSAP & ETS compatible
Enables next-gen data architectures

— PRODUCT —

Our First Platform Release

Introducing the first high-performance substrate dielectric film made in the USA. Thintronics on Substrate (TOS) was designed to enhance both security and supply chain resilience.

PRODUCT SPOTLIGHT