More Data. Faster.

Data demand has increased steadily over the last decade. AI integration has seen that demand grow exponentially.

Thintronics optimizes Interconnect Insulation enabling the highest data rates at the lowest power consumption.



Features

Next generation technology requires electronics to do more in less space at higher data rates and with the lowest power consumption.

Speed

Thintronics is enabling hi speed interconnect at 224 Gbps and 6G for wireless RF.

Power

Reducing channel loss delivers the lowest power consumption for high-speed interconnects.

Form Factor

50% thickness reduction with less weight for greater design and application flexibility.


Applications

AI Data Center

Optimizing power to process more data with the lowest pJ/bit.

Networking

Unified Insulator Platform across Compute, Switching and Networks.

RF Microwave

Reduced loss for RF systems with better connectivity and higher signal quality.

Devices

Massive design impact for next generation Interactive, Wearable, Edge AI, Entertainment…



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Leadership

Stefan Pastine, Ph.D.

Founder & CEO

Co-founder of Connora Technologies, which invented and commercialized technology that made an important industrial plastic recyclable (a.k.a. Recyclable Thermosets). The technology is currently used by Siemens-Gamesa to make recyclable windmill blades. Recyclable thermosets will divert 26 billion pounds of waste a year from landfills. Stefan led Connora from the founding concept through multiple financing rounds, R&D, scale-up, commercialization and finally through acquisition. Exited 2019.

Tristan El Bouyadi, Ph.D.

CTO

Engineering Leader with 14 years of experience in design and characterization RF, mmW, THz, Quantum Computing and High-Speed hardware in both early-stage and large-scale industrial environments. Experience in semiconductor co-design and manufacturing flows, Signal & Power Integrity, Antennas and Semiconductor Packaging.

Luc Beauviller

VP, Application Engineering

PCB veteran with 25-years of experience in both PCB fabrication & PCB materials technical marketing. Former Director, OEM Marketing ITEQ Corporation and ISOLA Group. Extensive industry connections with key OEMS and PCB fabs both in the US and globally. Luc has worked for some of the most important PCB players in the industry.


Desi Bonato

Board Member

Former CEO of MIPS. Prior to the CEO role, Desi led the acquisition from Imagination. He has a broad range of experience in early-stage technology startups as entrepreneur and investor as one of the founding partners in Tallwood VC. Desi holds a BS and an MS in Materials Science from UC Berkeley.

Alexandra McManus

Board Member

Chairman of the Board and Co-Founder of Eyrus, a venture backed IOT software platform. Former BOD of Connora Technologies (sold in 2019). Former EVP focused on data and software in the construction industry (sold twice through PE). Holds an BS in Mechanical Engineering from Univ of MD, and an MBA from UC Berkeley.

Kenneth Safar

Board Member

Kenneth Safar is a Managing Director on Maverick’s technology investment team. Prior to joining Maverick in 2021, he was a private equity investment associate at Thomas H. Lee Partners, before that he worked in investment banking at Goldman, Sachs & Co. Mr. Safar holds an M.B.A. from Harvard Business School and a B.S. in finance and information systems from NYU Stern.

Brendan Walsh

Board Member

Brendan seeks investment opportunities in companies boasting strong, defensible technology, especially those in cloud computing infrastructure, serving data centers and enterprises across the full value chain, from semiconductors to sophisticated software applications, and he maintains a strategic focus on sustainability and innovative climate technologies for future growth.




Careers

Competitive Bay Area Salary · 100% Employee Coverage for Health/Vision/Dental Insurance
Unlimited PTO Policy + 10 Company Holidays · Equity/Stock Options

Senior/Lead Engineer – EE Hardware Architecture

$170,000 - 190,000/yr · Berkeley, CA

We are looking for a talented Packaging Process Integration Engineer to support Thintronics materials adoption in Advanced Semiconductor applications. This is a high-visibility/high-impact role with leadership growth potential. The position responsibilities include High-Speed Digital (SERDES) and Radiofrequency Hardware Architecture, PCB and Advanced Packaging Layout, and more.


Substrate Process Engineer

$160,000 - 190,000/yr · Berkeley, CA

We are looking for a talented Packaging Process Integration Engineer to support Thintronics’ adoption into advanced semiconductor applications. This is a high-visibility/high-impact role with leadership growth potential.


Scientist I-III/Senior

Polymer Formulation & Materials Characterization

$110,000 - 180,000/yr · Berkeley, CA

Thintronics is looking for a Scientist to contribute to our new product R&D efforts, including formulation and characterization of dielectric films. This position requires broad working knowledge of polymers/composites, organic chemistry, as well as physical and electrical/dielectric measurements. Roles and responsibilities may evolve based on the needs of our quickly growing company and your skillset/interests.


Research Associate

$90,000 - 110,000/yr · Berkeley, CA

Thintronics is looking for a detail-oriented and enthusiastic research associate to join our R&D team. This role focuses on formulation/sample preparation and/or physical characterization of samples, including thermal, mechanical, adhesive, and dielectric property measurements. In this position, you will help deepen our understanding of the core Thintronics technology and develop our product pipeline.




Partners

Ansys

Engineering Simulation Software

Ansys, Inc. is an American multinational company with its headquarters based in Canonsburg, Pennsylvania. It develops and markets CAE/multiphysics engineering simulation software for product design, testing and operation and offers its products and services to customers.

The National Science Foundation

United States Government Agency

The National Science Foundation is an independent agency of the United States federal government that supports fundamental research and education in all the non-medical fields of science and engineering. Its medical counterpart is the National Institutes of Health.




Press Kit

For all press and media inquiries regarding Thintronics, our innovative technologies, and how we're steering the future of high-speed data transfer and AI integration, please reach out to press@thintronics.com.Get in touch for detailed press releases, high-resolution images, executive biographies, and to schedule interviews with our leadership team. Contact us to access the resources you need for accurate and current reporting on Thintronics and the exciting advancements we're bringing to the technological landscape.



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