AnInterconnectDielectricPlatformfortheTerabitEra
— LEARN —
Watch Our Brand Film
Advanced chips still rely on inner layer dielectrics from one Asian supplier, a choke point that once shut down auto production and now limits performance. Thintronics is reinventing interconnect dielectrics through integrated computational, molecular, electrical, and process engineering, delivering a 10X, made in the USA, alternative for the terabit age.
— VISION —
A Unified Dielectric that Works Everywhere
A single, insertion loss optimized, insulator form-factor that works across the interconnect stack: PCB, Substrate, and Interposer.
Enables the lowest pj/bit
Simplifies supply chain
SAP, MSAP & ETS compatible
Enables next-gen data architectures
— PRODUCT —
Our First Platform Release
Introducing the first high-performance substrate dielectric film made in the USA. Thintronics on Substrate (TOS) was designed to enhance both security and supply chain resilience.
Thintronics on Substrate (TOS)
Substrates made with Thintronics deliver 30-50% better insertion loss at 224G/448G PAM4.
