AnInterconnectDielectricPlatformfortheTerabitEra
— LEARN —
Watch Our Brand Film
Advanced chips still hinge on build-up film from a single Asian supplier, a choke point that shut down auto production once and now limits performance. Thintronics is reinventing interconnect dielectrics through integrated computational, molecular, electrical, and process engineering, delivering a 10X US made alternative for the terabit age.
— VISION —
A Form Factor that Works Everywhere
High-speed interconnects have created an industry inflection point. Thintronics leads a paradigm shift where new material platforms overcome fundamental limits of speed, heat, and power.
Enables the lowest pj/bit
Simplifies supply chain
SAP, MSAP & ETS compatible
Enables next-gen data architectures
— PRODUCT —
Our First Platform Release
Introducing the first U.S.-made high-performance build-up film, enhancing security and supply chain resilience.
Thintronics on Substrate (TOS)
Substrates made with Thintronics deliver 30-50% better insertion loss at 224G/448G PAM4.
