Speed

Thintronics is enabling hi speed interconnect at 224 Gbps and 6G for wireless RF.

Power

Reducing channel loss delivers the lowest power consumption for high-speed interconnects.

Form Factor

50% thickness reduction with less weight for greater design and application flexibility.

AI Data Center

Optimizing power to process more data with the lowest pJ/bit.

Networking

Unified Insulator Platform across Compute, Switching and Networks.

RF Microwave

Reduced loss for RF systems with better connectivity and higher signal quality.

Devices

Massive design impact for next generation Interactive, Wearable, Edge AI, Entertainment…

Leadership

Careers

Partners

Press

Stefan Pastine, Ph.D.

Founder & CEO

Co-founder of Connora Technologies, which invented and commercialized technology that made an important industrial plastic recyclable (a.k.a. Recyclable Thermosets). The technology is currently used by Siemens-Gamesa to make recyclable windmill blades. Recyclable thermosets will divert 26 billion pounds of waste a year from landfills. Stefan led Connora from the founding concept through multiple financing rounds, R&D, scale-up, commercialization and finally through acquisition. Exited 2019.

Tristan El Bouyadi, Ph.D.

CTO

Engineering Leader with 14 years of experience in design and characterization RF, mmW, THz, Quantum Computing and High-Speed hardware in both early-stage and large-scale industrial environments. Experience in semiconductor co-design and manufacturing flows, Signal & Power Integrity, Antennas and Semiconductor Packaging.

Luc Beauviller

Sr. Director, Applications Engineering

PCB veteran with 25-years of experience in both PCB fabrication & PCB materials technical marketing. Former Director, OEM Marketing ITEQ Corporation and ISOLA Group. Extensive industry connections with key OEMS and PCB fabs both in the US and globally. Luc has worked for some of the most important PCB players in the industry.

Desi Banatao

Board Member

Former CEO of MIPS. Prior to the CEO role, Desi led the acquisition from Imagination. He has a broad range of experience in early-stage technology startups as entrepreneur and investor as one of the founding partners in Tallwood VC. Desi holds a BS and an MS in Materials Science from UC Berkeley.

Alexandra McManus

Board Member

Chairman of the Board and Co-Founder of Eyrus, a venture backed IOT software platform. Former BOD of Connora Technologies (sold in 2019). Former EVP focused on data and software in the construction industry (sold twice through PE). Holds an BS in Mechanical Engineering from Univ of MD, and an MBA from UC Berkeley.

Kenneth Safar

Board Member

Kenneth Safar is a Managing Director on Maverick’s technology investment team. Prior to joining Maverick in 2021, he was a private equity investment associate at Thomas H. Lee Partners, before that he worked in investment banking at Goldman, Sachs & Co. Mr. Safar holds an M.B.A. from Harvard Business School and a B.S. in finance and information systems from NYU Stern.

Brendan Walsh

Board Member

Brendan seeks investment opportunities in companies boasting strong, defensible technology, especially those in cloud computing infrastructure, serving data centers and enterprises across the full value chain, from semiconductors to sophisticated software applications, and he maintains a strategic focus on sustainability and innovative climate technologies for future growth.

Daniel Franke

Board Observer

Daniel is an Investment Director at M Ventures and responsible for tech investments out of M Ventures’ €600 million Science & Technology fund. Daniel joined M Ventures in the Performance Materials team in 2019. Daniel obtained his Bachelor’s and master’s in chemistry at RWTH Aachen University before moving on to the Massachusetts Institute of Technology for his Ph.D.

• Apply

Senior/Lead Engineer – EE Hardware Architecture

$170,000 - 190,000/yr · Berkeley, CA

We are looking for a talented Packaging Process Integration Engineer to support Thintronics materials adoption in Advanced Semiconductor applications. This is a high-visibility/high-impact role with leadership growth potential. The position responsibilities include High-Speed Digital (SERDES) and Radiofrequency Hardware Architecture, PCB and Advanced Packaging Layout, and more.

• Apply

Substrate Process Engineer

$160,000 - 190,000/yr · Berkeley, CA

We are looking for a talented Packaging Process Integration Engineer to support Thintronics’ adoption into advanced semiconductor applications. This is a high-visibility/high-impact role with leadership growth potential.

Maverick Capital

Hedge Fund Firm

Maverick Capital is an American hedge fund firm. It was founded by Lee Ainslie in 1993, who was a "Tiger Cub" under Julian Robertson at Tiger Management, helped raise $38 million in capital by the family of Texas entrepreneur Sam Wyly. From 1995 to 2014, the fund returned a compounded return of 13% annually.

Translink Capital

Venture Capital Firm

Translink Capital is an early-stage venture capital firm based in Palo Alto with $1B under management, and investing out of its fifth fund. The fund’s mission is to partner with US entrepreneurs, and add value by leveraging the firm’s proprietary insights and connections to strategic Asian partners.

M Ventures

Venture Capital Firm

M Ventures is the strategic, corporate venture capital fund of Merck KGaA, Darmstadt, Germany, investing in Biotechnology and Technology. They cover the areas of Healthcare drug development, Life Science tools, Electronics and Frontier Technology & Sustainability.

TGVP

Venture Capital Firm

TGVP is the US Corporate Venture Capital arm of TOPPAN, Inc. Founded in 2022, the San Mateo based firm is focused on venture capital investments in US startup companies in Sustainability and Digital Transformation.

Ansys

Engineering Simulation Software

Ansys, Inc. is an American multinational company with its headquarters based in Canonsburg, Pennsylvania. It develops and markets CAE/multiphysics engineering simulation software for product design, testing and operation and offers its products and services to customers.

The National Science Foundation

United States Government Agency

The National Science Foundation is an independent agency of the United States federal government that supports fundamental research and education in all the non-medical fields of science and engineering. Its medical counterpart is the National Institutes of Health.

• Press

For all press and media inquiries regarding Thintronics, our innovative technologies, and how we're steering the future of high-speed data transfer and AI integration, please reach out to press@thintronics.com.Get in touch for detailed press releases, high-resolution images, executive biographies, and to schedule interviews with our leadership team. Contact us to access the resources you need for accurate and current reporting on Thintronics and the exciting advancements we're bringing to the technological landscape.

Thintronics Secures Series a Extension to Advance High-Performance Insulators for Next-Gen Electronics

https://www.rdworldonline.com/thintronics-secures-series-a-extension-for-advanced-insulators-in-next-gen-electronics/Berkeley-based advanced materials startup Thintronics has secured an undisclosed Series A Extension, led by Maverick Capital and Translink Capital, to accelerate its mission of revamping insulator technology for high-performance electronics. The round, which includes strategic investments from M Ventures (Merck KGaA’s corporate venture capital (CVC) arm) and TGVP (Toppan Holdings’ U.S. CVC arm), will fuel Thintronics’ expansion and support its efforts to displace fiberglass in advanced applications like AI data centers and 5G/6G infrastructure...

This US Startup Makes a Crucial Chip Material and Is Taking on a Japanese Giant

https://www.technologyreview.com/2024/04/11/1091143/thintronics-ajinomoto-dielectric-chip-semiconductor-competition/It can be dizzying to try to understand all the complex components of a single computer chip: layers of microscopic components linked to one another through highways of copper wires, some barely wider than a few strands of DNA. Nestled between those wires is an insulating material called a dielectric, ensuring that the wires don’t touch and short out. Zooming in further, there’s one particular dielectric placed between the chip and the structure beneath it; this material, called dielectric film, is produced in sheets as thin as white blood cells...

Thintronics Inc. Closes $23M Series A Financing Round Led by Maverick Capital and Translink Capital

https://finance.yahoo.com/news/thintronics-inc-closes-series-extension-210600462.htmlThintronics Inc. is a California-based electronic materials startup supplying high-performance insulators for emerging AI datacenter, networking, and RF/millimeter-wave (mmW) applications. Thintronics Inc. has raised a Series A funding round for $23M, led by Maverick Capital and Translink Capital. Series A funding will support commercialization of a novel insulator platform...