Thintronics for PCs
33% thinner electronics = 100% better PCs
The PC industry has reached a tipping point. Enabling the next generation of innovation requires motherboards as thin as 0.8 mm, and you just can’t get there with the FR4 dielectrics of today. PC manufacturers need a new dielectric platform, something that's super-thin but also cost-effective and easy to process.
Thintronics® is that something. It is the world’s thinnest hybrid dielectric system easily capable of meeting the demands of a standard 0.8 mm form factor motherboard with 12 layers of circuit routing.In fact, the Standard Thintronics 1 mil platform can go far beyond 12 layers to accommodate 16-layer construction with that same 0.8 mm form factor.
On the manufacturing side, the unlimited shelf life of Thintronics dielectrics helps eliminate excess & obsolescence costs. Highly uniform dielectric spacing improves PCB yield by improving impedance tolerance to only 5%. Post-processing is streamlined and machining is improved, allowing for smaller, more precise microvia. The coupling of resource reduction with capacity improvement means Thintronics represents one of those rare instances where new technology is driving next-level innovation without driving up costs or manufacturing complexity.
Thintronics for Mobile Devices
Space is tight; Thintronics lets you to do more in less
Future mobility innovation boils down to the simplest of formulas: thinner boards + decreased line space = a higher I/O count and a more powerful, featured-enhanced device.
With our Standard 1 mil platform, Thintronics reduces the overall thickness of each dielectric layer in your device. This reduction is directly proportional to a reduction in microvia size and an increase in the I/O count of the main processor. The closer the pins, the more functions per area. Even better, this setup requires less power to transfer signals between pins.
What can Thintronics do for your mobile PCB design today? Here are three examples:
Simplify & save real estate
You can cut your layer count in half, transforming your package design from a 12L (5+2+5)/0.8mm configuration to a 6L (2+2+2)/0.3mm configuration with 1 mil Thintronics as the buildup layers and a 2 mil FR4 Core. This lower layer count Thintronics® configuration is more affordable, easier to fabricate, and has the same routing output as 12L design, which is two-and-a-half times thicker. In addition to the space and weight savings gained with Thintronics, your power consumption and battery life will also improve because of shorter trace distances
Get more innovative & add features (and still save space)
If your goal is to produce the most feature enhanced product possible, you can stick with high layer configurations, and Thintronics will provide that next-level performance platform to design from. In a 0.5mm form factor, Standard Thintronics enables a 12L any-layer HDI design with ultra-fine BGA pitch and a doubling of I/O pin count. All of this performance in a form-factor that is 20-40% thinner than your current 12L design.
Tap into unlimited layers, not unlimited costs
With Thintronics, you can fabricate unlimited build-up layers, and adding layer count will still be cheaper and easier to manufacture than your current FR4 board. Using the 0.8 mm package used in today’s most advanced mobile devices as an example, you can fabricate a 20-layer PCB with Thintronics. With each of those layers doubling routing density compared to an FR4 layer, this 20-layer Thintronics-driven PCB configuration will triple your available circuit density.
This is only where our thin dielectric roadmap begins.
Ultra Thintronics is a 0.5 mil building block already available for release, so when you are ready to go even thinner, we are ready to help you get there fast.
Thintronics for Autonomy
The density inside self-driving cars
Core autonomous driving components like LiDAR, radar, and cameras leave no room for error. They need to perform flawlessly. The Standard Thintronics 1 mil platform delivers significant improvements to LiDAR, camera, and radar components that help OEMs ensure this flawless performance on a global scale.
Today’s LiDAR design comprises two conductive layers in a skew-mitigated 0.15 mm package. Thintroincs enhances this design while significantly reducing its manufacturing costs. How? By increasing the density with four conductive layers (1+2+1) in a 0.15 mm package design. Thintronics provides the “no skew” configurations on the top and bottom layers, which means you can swap out your current expensive skew mitigation layer with an inexpensive FR4 core. This unique configuration doubles the density of laser diodes per package at producible line widths. With highly uniform 1 mil dielectric spacing, the Standard Thintronics platform doubles the routing space for signal traces while improving impedance performance.
Camera modules also benefit from the increased I/O count enabled by Thintronics’ tighter pitch. By reducing the microvia size from 75 um to 35-50 um, our platform can increase the total I/O of the photosensor by up to 25%. This increased I/O improves camera resolution and thus enhances the image quality fed into an autonomous vehicle’s decision system. Better quality camera images mean better driving decisions, which means a safer autonomous car.
Additionally, most PCB materials incorporate a weave pattern that can introduce skew into the signal that degrades the accuracy of most 77 GHz car radar systems. Thintronics has no skew-enhanced signal integrity. Even better, Thintronics can replace Teflon alternatives that are difficult to process due to their PCB incompatibility — at a fraction of the cost.
Thintronics for IoT
Smaller, more efficient sensors.
Smarter, more efficient devices.
Every second 127 new IoT devices are connected to the web, and the Thintronics platform could enhance the performance of every one of them. IoT devices built with Thintronics shrink from the typical 4L /0.25 mm PCB form factor to a 4L /0.15 mm package, which doubles the routing density at half the distance. By creating a PCB that is 40% thinner and 50% more energy efficient than your PCB today, Thintronics throws open the doors on performance for a new generation of smarter, more efficient IoT devices.
Our platform brings cost, weight, and power benefits to OEM miniaturization efforts in two critical ways:
Thintronics enables ultra-small microvia that increase the density and reduce the trace distances to connect device features, thus significantly reducing the power required for a smart sensor to operate.
Thintronics helps OEMs achieve this high density at a far lower cost than traditional materials. Most materials used to deliver the same design features enabled by Thintronics are premium grade, increasing as thickness decreases. Not so with Thintronics, making our platform the low-cost alternative for OEMs looking to create the smaller, field-deployed sensors and devices that enable smart everything.
Thintronics for Drones & Defense
Less weight on the ground.
More time in the sky.
Just like with cell phones, future drone innovation relies on higher density but lighter weight PCBs capable of delivering more functionality with less energy consumption. The Thintronics platform delivers both by helping OEMs increase their routing density in a lighter weight, more compact, and more energy-efficient package.
Today’s main board design in advanced drones is 12-layer construction in an 0.8 mm package. Thintronics allows you to slash that layer count in half or double its routing density. Here’s how:
A 6L (2+2+2) configuration, using 1 mil Thintronics as the build-up layers and an FR4 as the core, essentially cuts your layer count in half. This new configuration reduces main board thickness by 60%, from 0.8 mm to 0.3 mm. Weight savings is even greater, as Thintronics density is merely 65% of a typical FR4. This lower layer count configuration has the same routing output as your current board, which is two-and-a-half times thicker and three times heavier. In addition to the space and weight savings gained with Thintronics, your power consumption and battery life will further improve because of shorter trace distances.
Alternatively, you can keep your 12L configuration and double your routing density to increase drone main board processing performance. Here, too, the shorter trace distances achieved with Thintronics consumes less power and increases battery life, and is coupled with a 33% reduction in thickness and a weight savings of 50% .
mSAP doesn't have to be ASAP
Conventional wisdom suggests that to accelerate the rate of innovation, you need to rethink your entire manufacturing processing flow, starting yesterday.
Thintronics begs to differ.
Make no mistake: modified Semi-Additive Processing (mSAP) is a big part of every major PCB manufacturer’s future, but that doesn’t mean you have to risk your razor-thin margins on a complete reformatting of your factory space today. With 45% of your current factory space allocated to conveyorized etching lines and substantial investments already made in expensive plating equipment, you need new dielectric materials that allow you to achieve higher levels of density without having to rebuild your factories.
Thintronics is that material.
And it allows PCB manufacturers to extend the onset of a changeover to additive manufacturing by up to ten years.
Our thin tech platform, combined with its low 3.0-3.1 Dk, allows you to achieve fine-pitch BGA routing and a 30-50% reduction in via diameter and capture pad diameter—while still reaching target impedances with line width form factors that can be processed with subtractive etching.
Not just thinner—faster, too.
Build-up lamination with Thintronics is quick, requiring minutes not hours. This translates to a reduction of press cycle times by 75%. Processing with Thintronics is easy, cutting post-processing time by up to 60%. Standard Thintronics is also highly uniform, with tight 1 mil dielectric spacing that cuts impedance tolerance in half to just 5%.
The now & the future.
In the short term, the unique combination of a low Dk and the thin tech construction of the Standard Thintronics 1 mil platform helps the entire supply chain deliver increased density while helping the manufacturer create a longer-term, more bottom-line friendly capital budget. In the longer term, the Ultra Thintronics 0.5 mil platform is equally cost effective, so once fully additive processing becomes the norm, Thintronics will be the only solution that can transition between the two mediums and support required density, thickness, and processing efficiencies.