PCBs will drive the next big leap in innovation

Remember what Apple’s vision for the high-density interconnect (HDI) printed circuit board did for the world thirteen years ago? It didn’t just herald the iPhone; it made the Internet of Things real. But the innovation leaps spawned in 2007 have slowed to incremental hops in 2020. Why? Because PCBs haven’t evolved. Thinner dielectrics changes all that by enabling higher routing density in smaller packages—and resetting today’s PCB design rules.

Innovation starts at the bottom

Until now, a select group of product companies has forced the manufacturing advancements that have driven PCB evolution. Everyone else follows status quo design rules that form a hard barrier between a product’s potential and what that product can actually do. Making PCB evolution equitable for everyone means starting at the bottom of the supply chain and re-inventing the molecular chemistry of a PCB’s dielectric material. This new perspective brings innovation, not forced change, to the industry.

Innovation is for everyone, not just the big guys

By introducing Thintronics on the supply chain’s ground floor, we bring today’s “trickle down” innovation model into a bolder "open source" future. We envision product companies of every size having the same access to innovation, at the same time. With equitable access comes greater simplification, too. Thintronics makes HDI PCBs less expensive and easier to manufacture—and eliminates complexity and product SKU overload in the PCB value chain.