We want to let you in on the secret to making your products, better, starting today:
Those printed circuit boards you currently build on? They’re no longer your only option.
We’ve redesigned the essence of dielectric DNA and invented an ultra-thin platform that allows anyone to triple routing density in a smaller form factor.
Want to know another secret?
Thinner, lighter, more powerful PCBs are easier and more affordable to make than you think.
Because, at Thintronics, we don't just re-think what a PCB can do. We reinvent the materials to make that re-thinking real.
This is Thintronics.
Now you don’t have to be a trillion-dollar company to innovate like one.
Choose the way Thintronics improves your design
1. Lose the layers. Keep the density.
Thintronics reduces your PCB layer count by 50% and your PCB thickness by 60% — all while maintaining your current interconnect density.
2. Add features, not layer counts.
Thintronics doubles your interconnect density and reduces your PCB thickness by 35% — without increasing your current PCB layer count.
3. Triple your density while staying thin.
Thintronics increases your layer count and triples your interconnect density—without increasing your current PCB thickness